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Fraunhofer cluster 3D integration - key to a holistic technology and service approach

 
: Wolf, Jürgen M.; Schulz, Stefan; Schneider, Peter; Zschech, Ehrenfried

Gessner, T.:
Smart Systems Integration 2014 : Wien/Österreich, 26.3.2014 - 27.3.2014; 8th International Conference and Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Aachen: Apprimus-Verlag, 2014
ISBN: 978-3-86359-201-1
S.599-602
Smart Systems Integration Conference (SSI) <2014, Vienna>
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <8, 2014, Vienna>
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()
Fraunhofer IZM ()
Fraunhofer ENAS ()
Fraunhofer IKTS ()
3D integration; design; TSV technology; analytics; reliability

Abstract
3D integration - as a key technology - is of high significance for the realization of future innovative products. With its outstanding competencies in the fields of technology, design and reliability, Fraunhofer-Gesellschaft offers an excellent base and prerequisite for the market-oriented implementation of 3D integration for the industry in Germany, Europe and worldwide. To meet the complexity of this technological approach, the Fraunhofer institutes IZM, ENAS, IIS-EAS, IKTS cluster their competencies in a network to cover a broad spectrum of topics related to 3D integration. The complex correlation of the different aspects of 3D integration and the synergies that are met by the Fraunhofer cluster enable a strong positioning as a competent and broad project, technology and service partner.

: http://publica.fraunhofer.de/dokumente/N-298273.html