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Solderjet technology used to assemble a robust miniaturized solid-state laser

Paper presented at the 2nd Laser Ignition Conference, LIC 2014, Yokohama, Japan, April 22 - 24, 2014
: Ribes, Pol; Burkhardt, Thomas; Hornaff, Marcel; Kousar, Sumera; Burkhardt, Diana; Beckert, Erik; Gilaberte, Marta; Guilhot, Denis; Montes, David; Galan, Miguel; Ferrando, Sara; Eberhardt, Ramona; Tünnermann, Andreas

Volltext urn:nbn:de:0011-n-2943232 (60 KByte PDF)
MD5 Fingerprint: 5031c0020d9c5438f4d4e8a1676ff745
Erstellt am: 11.7.2014

2014, Paper LIC7-4, 2 S.
Laser Ignition Conference (LIC) <2, 2014, Yokohama>
Vortrag, Elektronische Publikation
Fraunhofer IOF ()
Laserlöten; solderjet bumping; miniaturisierter Laserresonator; klebstofffreie Aufbau- und Verbindungstechnik; Luft- und Raumfahrtanwendung

A Soldering technique based on laser-induced Solderjet Bumping is used to assemble a miniaturized laser resonator in order to develop a completely adhesive-free device. Different laser materials such as Nd:YAG, second harmonic generator BBOs and fused silica are soldered onto an AIN-based ceramic substrate. Compared glued and soldered but otherwise identical diode-pumped solid-state lasers resulted in higher robustness; wider thermal conductivity performance; higher vacuum and radiation compatibility and better temperature and long-term stability in the soldered prototypes. The assembled lasers passed the required specifications to use this device in the future Raman Laser Spectrometer for the ExoMars European Space Agency (ESA) space mission 2018. Thanks to the potential benefits of this soldering technique, laser devices for various applications such as laser ignition can be improved for better reliability and extreme condition performance.