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Upscaling plasma deposition

The influence of technological parameters
: Corbella, C.


Surface and coatings technology 242 (2014), S.237-245
ISSN: 0257-8972
Fraunhofer IST ()
upscaling; cold plasma; technological parameters

The technological parameters that control plasma processes follow several scaling rules. Hence, we must adapt inlet gas flow rate, pressure, input power and excitation frequency to the new reactor dimensions. High rates of film deposition or etching; plasma homogeneity, and reproducibility are the main objectives in any attempt to upscaling. This paper provides guidelines to transfer plasma deposition processes from small pilot reactors to large plants for industrial production.