Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. Thick film pastes for nitride ceramics for high power applications
| International Microelectronics Assembly and Packaging Society -IMAPS-:
46th International Symposium on Microelectronics, IMAPS 2013 : September 30 - October 3, 2013, Orlando, Florida
Reston, Va.: IMAPS, 2013
ISBN: 978-1-62993-824-0 (Curran-Ausgabe)
S.689-694 |
| International Symposium on Microelectronics (IMAPS) <46, 2013, Orlando/Fla.> |
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| Englisch |
| Konferenzbeitrag |
| Fraunhofer IKTS () |
| thick film pastes; AlN; Si3N4; resistor; high power |