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Quasi-simultaneous laser soldering for the interconnection of back-contact solar cells with composite foils

: Britten, S.W.; Seva Bala Sundaram, R.; Olowinsky, A.; Gillner, A.

Postprint urn:nbn:de:0011-n-2833526 (856 KByte PDF)
MD5 Fingerprint: c1433b27ca4e27b78c1126e1f29eae8e
Erstellt am: 20.3.2014

Klotzbach, U. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based Micro- and Nanoprocessing VIII : February 2014, San Francisco, California, United States
Bellingham, WA: SPIE, 2014 (SPIE Proceedings 8968)
ISBN: 978-0-8194-9881-6
Paper 89680V
Conference "Laser-Based Micro- and Nanoprocessing" <8, 2014, San Francisco/Calif.>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ILT ()

In this contribution we evaluate laser scanning approaches for the interconnection of the 31 electrical contacts of a MWT back-contact solar cell. The selective energy deposition with a laser system allows the minimization of thermomechanical stress in the wafer, but requires adapted scanning strategies to prevent damages in the solar cell top layer. The laser scanning process of the MWT solar cell is conducted in combination with a composite foil as an interconnector and a pre-dispensed solder paste. This approach is evaluated regarding the joining quality of the interconnection as a function of the scanning strategy.