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Package Characterization with Stress Chip Measurements for Health Monitoring
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2013
Conference Paper
Titel
Package Characterization with Stress Chip Measurements for Health Monitoring
Author(s)
Rost, F.
Schindler-Saefkow, Florian
Otto, Alexander
Rzepka, Sven
Michel, Bernd
Hauptwerk
Smart Systems Integration 2013. CD-ROM
Konferenz
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components 2013
Language
English
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Fraunhofer-Institut für Elektronische Nanosysteme ENAS