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A new packaging approach for reliable high temperature MEMS devices based on multilayer ceramic interposers

 
: Roschner, F.; Otto, A.; Döring, R.; Ihle, M.; Ziesche, S.; Rzepka, S.; Wiemer, M.

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AMA Fachverband für Sensorik e.V., Wunstorf:
AMA Conferences 2013. Proceedings. With SENSOR, OPTO, IRS 2. CD-ROM : Nürnberg Exhibition Centre, Germany, 14. - 16.5.2013
Wunstorf: AMA Service, 2013
ISBN: 978-3-9813484-3-9
S.236-241
International Conference on Sensors and Measurement Technology (SENSOR) <16, 2013, Nuremberg>
Englisch
Konferenzbeitrag
Fraunhofer IKTS ()
Fraunhofer ENAS ()

Abstract
In this work, we will describe a promising procedure for the development of a silicon based micro electro mechanical system (MEMS) suitable for 300 °C operation temperature. Design aspects as well as a suitable packaging concept and technology will be highlighted. The value of accompanying FEM simulations together with the usage of novel reliability tools will be demonstrated as a design and construction accelerator that can help to avoid typical mistakes within the material selection and concept phase of a MEMS fabrication process. We will give an introduction for suitable wafer-levelbonding methods for multilayer stacking of functional substrates especially for the heterogeneous integration of silicon and low temperature co-fired ceramic LTCC (low temperature co-firing ceramic). The fabrication process for LTCC with electrical feed troughs and for Silicon substrates with through silicon vias TSVs (through-silicon via) and a subsequent electrical interconnection between both will also be topics of this work.

: http://publica.fraunhofer.de/dokumente/N-275692.html