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Halbleiterbauelement im Mehrschichtaufbau und hieraus gebildetes Modul

SEMICONDUCTOR COMPONENT HAVING A MULTI-LAYER STRUCTURE AND MODULE FORMED THEREFROM
 
: Wiesenfarth, Maike; Guter, Wolfgang; Helmers, Henning

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Frontpage ()

DE 102011115340 A1: 20111007
Deutsch
Patent, Elektronische Publikation
Fraunhofer ISE ()

Abstract
The invention relates to a semiconductor component having a multi-layer structure, wherein a bypass diode is monolithically integrated into the semiconductor component. The invention further relates to modules that are constructed from several of said semiconductor components. The invention relates in particular to multi-junction solar cells in photovoltaics.

: http://publica.fraunhofer.de/dokumente/N-270819.html