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Analysis of the plastic deformation in aluminium metallizations of Al2O3 - based DAB substrates

 
: Poller, T.; Lutz, J.; Boettge, B.; Knoll, H.

:

Institute of Electrical and Electronics Engineers -IEEE-; European Power Electronics and Drives Association -EPE-; IEEE Power Electronics Society:
15th European Conference on Power Electronics and Applications, EPE 2013. Vol.4 : Lille, France, 2 - 6 September 2013
Piscataway, NJ: IEEE, 2013
ISBN: 978-1-4799-0115-9 (print)
ISBN: 978-1-4799-0114-2 (USB)
ISBN: 978-1-4799-0116-6 (online)
S.3739-3748
European Conference on Power Electronics and Applications (EPE) <15, 2013, Lille>
Englisch
Konferenzbeitrag
Fraunhofer IWM ( IMWS) ()
aerospace; packaging; thermal stress; thermal design

Abstract
DAB are a new kind of substrates in which the copper layer was replaced by an aluminum layer. In [1] a increase of the roughness of these aluminum layer was observed during thermal cycling tests. A similar effect was observed during power cycling tests in [2, 3]. This paper will discuss this effect with experimental results and Finite Element (FEM) simulations.

: http://publica.fraunhofer.de/dokumente/N-267340.html