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2013
Conference Paper
Titel
Wet chemical single-side emitter etch back for MWT solar cells with AL-BSF and challenges for via paste selection
Abstract
This work investigates the integration of a wet chemical single-side emitter etching process into the process sequence of screen printed p-type Czochralski-grown silicon MWT-BSF (metal wrap through aluminum back surface field) solar cells. The MWT-BSF solar cells fabricated with single-side emitter etch back achieve a median conversion efficiency of 18.4 % (as processed), while MWT-BSF solar cells isolated by laser grooves show a slightly lower median conversion efficiency of 18.2 % (as processed). Repeated current-voltage (I-V) measurements under forward and reverse bias using stabilized MWT-BSF solar cells with single-side emitter etch back confirm that a novel via paste enables stable results under forward bias (standard operation mode), although the via paste is in direct contact with the p-type base. MWT-BSF solar cells with single-side emitter etch back show increasing current densities under reverse bias without affecting the cell performance after repeated I-V measurements, this behaviour could be used for an integrated bypass approach. The results confirm the successful integration of single-side emitter etch back into the MWT-BSF process sequence allowing for the reduction of the process sequence by one process step compared to MWT-BSF solar cells isolated by laser grooves.
Author(s)
Tags
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PV Produktionstechnologie und Qualitätssicherung
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Silicium-Photovoltaik
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Oberflächen - Konditionierung
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Passivierung
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Lichteinfang
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Kontaktierung und Strukturierung
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Herstellung und Analyse von hocheffizienten Solarzellen
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Pilotherstellung von industrienahen Solarzellen
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MWT-BSF
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P-Type
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Solar Cell
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Metallisation