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A versatile timing microsystem based on wafer-level packaged XTAL/BAW resonators with sub-µW RTC mode and programmable HF clocks

: Ruffieux, D.; Scolari, N.; Giroud, F.; Le, T.C.; Piazza, S.D.; Staub, F.; Zoschke, K.; Manier, C.A.; Oppermann, H.; Dekker, J.; Suni, T.; Allegato, G.


Fujino, L.C. ; Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International Solid-State Circuits Conference, ISSCC 2013. Digest of technical papers : San Francisco, California, USA, 17 - 21 February 2013
New York, NY: IEEE, 2013
ISBN: 978-1-4673-4515-6 (Print)
ISBN: 978-1-4673-4513-2
ISBN: 978-1-4673-4516-3
International Solid-State Circuits Conference (ISSCC) <60, 2013, San Francisco/Calif.>
Fraunhofer IZM ()

Over recent years the several decades long quartz-dominated timing industry has been continuously challenged by the introduction of new products or demonstration of prototypes based on MEMS resonators [1-4]. The poor intrinsic stability of such devices has led to the development of very high performance temperature sensors to reach TCXO-level frequency stability [5]. One of the true advantages of the technology is the fact that well-proven semiconductor manufacturing technologies amenable for high volume production can be leveraged to produce wafer-level encapsulated low-cost components. This paper explores how XTAL resonators could benefit from similar wafer level, vacuum sealing packaging technologies with the demonstration of a generic versatile timing module.