Fraunhofer-Gesellschaft

Publica

Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Low cycle fatigue measurement results on real flip chip solder contacts

 
: Metasch, R.; Roellig, M.; Roehsler, A.; Boehm, C.; Wolter, K.-J.

:

Institute of Electrical and Electronics Engineers -IEEE-:
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : 14-17 April 2013, Wroclaw, Poland
New York, NY: IEEE, 2013
ISBN: 978-1-4673-6138-5
ISBN: 978-1-4673-6139-2
6 S.
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
The paper presents low cycle fatigue results and properties as measured by small solder joints in a shear test setup. These symmetrical triangle experiments were performed at 25 °C by the variation of the specimen's displacements and the solder joint materials. The displacements varied between 2 m and 8 µm to get strains up to 2 % and stresses up to 40 MPa. The used solder ball alloys are SnAg3.5, SnAg3.0Cu0.75 and SnPb36. The strain rate was close to 1E-2 per second.

: http://publica.fraunhofer.de/dokumente/N-264501.html