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Novel quick predict approach for identification of critical loadings in electronic components on PCB under vibration realized as design support tool

 
: Roellig, M.; Metasch, R.; Schingale, A.; Schießl, A.; Meier, K.; Meyendorf, N.

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Institute of Electrical and Electronics Engineers -IEEE-:
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013 : 14-17 April 2013, Wroclaw, Poland
New York, NY: IEEE, 2013
ISBN: 978-1-4673-6138-5
ISBN: 978-1-4673-6139-2
6 S.
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) <14, 2013, Wroclaw>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
The paper presents an approach to bring numerical simulation and electronic design engineering closer together. In focus is the development of a design support tool, based on Finite Element Analysis as an automated running system behind an engineer adapted Graphical User Interface platform. The Quick Predict tool will have the capability to fast calculated mechanical stresses on PCB and electronic components, which are loaded by vibration. Vibration loading usually occurs in mobile transportation systems or mechanical motion systems. The paper presents the solution of the easy and quick input of geometry variations, material variation and different vibration scenarios reflected on the example of an Electronic Control Unit (ECU). The automated generation of the virtual model is based on the available general design parameter. A set of material data was determined experimentally. A suitable way to insert material data variations for PCB with low effort on measurements was developed and integrated. The engineers target to achieve, with the approach, is to improve vibration resistivity of electronic components or to design new configurations of PCB with vibration critical components with very low time consumption.

: http://publica.fraunhofer.de/dokumente/N-264492.html