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Semi-insulating substrate based generic InP photonic integration platform

: Soares, F.M.; Janiak, K.; Kreissl, J.; Moehrle, M.; Grote, N.


Fédéli, J.-M. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Integrated photonics: Materials, devices, and applications II : 24 - 26 April 2013, Grenoble, France
Bellingham, WA: SPIE, 2013 (Proceedings of SPIE 8767)
ISBN: 978-0-8194-9564-8
Paper 87670M
Conference "Integrated Photonics - Materials, Devices, and Applications" <2, 2013, Grenoble>
Fraunhofer HHI ()

In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.