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Hier finden Sie wissenschaftliche Publikationen aus den FraunhoferInstituten. Modeling and minimizing the inductance of bond wire interconnects
 Institute of Electrical and Electronics Engineers IEEE: 17th IEEE Workshop on Signal and Power Integrity, SPI 2013 : 1215 May 2013, Paris New York, NY: IEEE, 2013 ISBN: 9781467356787 (Print) ISBN: 9781467356794 4 S. 
 Workshop on Signal and Power Integrity (SPI) <17, 2013, Paris> 

 Englisch 
 Konferenzbeitrag 
 Fraunhofer IZM () 
Abstract
In this paper, a novel analytical model for calculating the partial selfinductance of bond wires in dependent on bonding parameters such as loop height, distance between bonding positions and the thickness of the metallization on which the wire is bonded, is derived for the first time. An excellent correlation is obtained between inductances extracted using our proposed model and those extracted using Ansys Q3D, with a maximum deviation of approximately 1%. Furthermore, methods for minimizing the inductance of bond wires, based on the definitions of loop and partial inductances are discussed. Test bond wire structures are designed, fabricated and measured to quantify the implemented method.