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Reliability of embedding concepts for discrete passive components in organic circuit boards

: Schwerz, R.; Boehme, B.; Roellig, M.; Wolter, K.-J.; Meyendorf, N.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 63rd Electronic Components and Technology Conference, ECTC 2013. Proceedings : 28-31 May 2013, Las Vegas, NV, USA
New York, NY: IEEE, 2013
ISBN: 978-1-4799-0233-0 (Print)
ISBN: 978-1-4799-0232-3
Electronic Components and Technology Conference (ECTC) <63, 2013, Las Vegas/Nev.>
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

This work presents the research towards two promising embedding approaches for electronic components with a possible application to integrate a sensor node for structural health monitoring into the structure itself. The production process for both integration methods has been assessed through experimental and simulation effort. Samples with passive components for both presented approaches have been successfully built. To evaluate the quality of the integration processes, the embedding samples along with regular SMT assemblies were subsequently tested towards reliability using tensile and temperature cycling tests with in-situ measurement. Both testing methods have also been supported with advanced finite element modeling to understand the structural behavior for the integration. The results have shown that both approaches can successfully be applied to integrate electronics into organic material. It was also found that the damage mechanism during the thermo mechanical loading for embedded components differs from conventional SMT assembly because the solder is completely fixated. With a correct manufacturing process this will yield an increase of life time for the electronics.