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2000
Conference Paper
Titel
Plasma-assisted deposition at atmospheric pressure using dielectric barrier discharges
Abstract
The report gives an account of applications of filamented dielectric barrier discharges to plasma-assisted film deposition at atmospheric pressure. It is demonstrated, that adhesion-promoting interlayers for organic coatings can be deposited on metals, yielding corrosion and adhesion performance comparable to state-of-the-art wet-chemical treatments. Using pulsed excitation of the discharge, plasma polymers with a high degree of retention of functional groups can be obtained.