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Cool silicon ICT energy efficiency enhancements

 
: Ellinger, F.; Mikolajik, T.; Fettweis, G.; Hentschel, D.; Kolodinski, S.; Warnecke, H.; Reppe, T.; Tzschoppe, C.; Dohl, J.; Carta, C.; Fritsche, D.; Wiatr, M.; Kronholz, S.D.; Mikalo, R.P.; Heinrich, H.; Paulo, R.; Wolf, R.; Hubner, J.; Waltsgott, J.; Meissner, K.; Richter, R.; Bausinger, M.; Mehlich, H.; Hahmann, M.; Moller, H.; Wiemer, M.; Holland, H.-J.; Gartner, R.; Schubert, S.; Richter, A.; Strobel, A.; Fehske, A.; Cech, S.; Assmann, U.; Hoppner, S.; Walter, D.; Eisenreich, H.; Schuffny, R.

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Schmidt, Georg (Ed.) ; Institute of Electrical and Electronics Engineers -IEEE-:
International Semiconductor Conference Dresden-Grenoble, ISCDG 2012 : Grenoble, France, 24 - 26 September 2012; Technology, design, packaging, simulation and test ; international conference, short course and table-top exhibition
New York, NY: IEEE, 2012
ISBN: 978-1-4673-1717-7 (Print)
4 S.
International Semiconductor Conference Dresden-Grenoble (ISCDG) <2012, Grenoble>
Englisch
Konferenzbeitrag
Fraunhofer IZFP, Institutsteil Dresden ( IKTS-MD) ()

Abstract
In this paper, we give an overview of some recent results achieved in the German cluster project Cool Silicon located around Dresden. Cool Silicon features around 50 projects and 100 partners from industry and research institutions, and aims at significantly increasing the efficiency in information and communications technology (ICT). Innovations in micro- and nanoelectronics, circuits, systems, sensors, software and regenerative supply technologies are tackled.

: http://publica.fraunhofer.de/dokumente/N-263876.html