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Analysis and comparison of methods for extracting the inductance and capacitance of TSVs

: Ndip, I.; Lobbicke, K.; Zoschke, K.; Guttowski, S.; Wolf, J.; Reichl, H.; Lang, K.-D.


Institute of Electrical and Electronics Engineers -IEEE-; IEEE Components, Packaging, and Manufacturing Technology Society:
IEEE 14th Electronics Packaging Technology Conference, EPTC 2012. Proceedings : 5 - 7 December 2012, Resort World Sentosa, Singapore
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4553-8 (Print)
ISBN: 978-1-4673-4551-4 (Online)
Electronics Packaging Technology Conference (EPTC) <14, 2012, Singapore>
Fraunhofer IZM ()

Closed-form expressions and numerical/measurement-based methods for extracting the inductance (L) and capacitance (C) of Through Silicon Vias (TSVs) are analyzed and compared for frequencies up to 40 GHz. The discrepancies between the methods are discussed. The TSVs are designed, fabricated and measured. Good correlation is obtained between L and C values of TSVs extracted from RF measurements and electromagnetic field simulations.