Publica
Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten. TSV modeling considering signal integrity issues
| International Microelectronics and Packaging Society -IMAPS-:
43rd International Symposium on Microelectronics, IMAPS 2010 : Raleigh, North Carolina, USA, 31 October - 4 November
Red Hook, NY: Curran, 2011
ISBN: 978-1-617-82320-6
S.572-576 |
| International Symposium on Microelectronics (IMAPS) <43, 2010, Raleigh/NC> |
|
| Englisch |
| Konferenzbeitrag |
| Fraunhofer IZM () |
Abstract
Since a TSV has a metal-insulator-semiconductor structure, it supports three fundamental modes namely, skineffect, slow-wave and dielectric quasi-TEM mode. In this contribution, we predict the frequency range of these modes, considering TSVs for interposer applications as an example. Furthermore, the impact of Si-resistivity on signal integrity is quantified and coaxial TSV configurations are proposed to minimize this impact.