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3D integration technologies for wireless sensor systems (e-CUBES)

 
: Ramm, P.; Taklo, M.; Weber, J.; Wolf, M.J.

International Microelectronics Assembly and Packaging Society -IMAPS-:
IMAPS International Conference and Exhibition on Device Packaging - In Conjunction with the Global Business Council, GBC 2008 Spring Conference
2008
S.189-196
International Conference and Exhibition on Device Packaging <4, 2008, Fountain Hills/Ariz.>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

: http://publica.fraunhofer.de/dokumente/N-263356.html