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3D system integration for high density interconnects

 
: Wieland, R.; Klumpp, A.; Ramm, P.

Proceedings of the Topical Workshop on Electronics for Particle Physics, TWEPP 2007 : Prague, Czech Republic, 3 - 7 September 2007
Geneva: CERN, 2007
ISBN: 978-92-9083-304-8
S.64-68
Topical Workshop on Electronics for Particle Physics (TWEPP) <2007, Prague>
Englisch
Konferenzbeitrag
Fraunhofer IZM ()

Abstract
3D-Integration is a promising technology towards higher interconnect densities and shorter wiring lengths between multiple chip stacks, thus achieving a very high performance level combined with low power consumption. This technology also offers the possibility to build up systems with high complexity by combining devices of different technologies. The fundamental processing steps will be described, as well as appropriate handling concepts and first electrical results of realized 3D-integrated stacks.

: http://publica.fraunhofer.de/dokumente/N-263238.html