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A combined simulative and experimental approach to reliability optimization of MEMS

: Wittler, O.; Keller, J.; Vogel, D.; Michel, B.

11th International Conference on Fracture 2005, ICF11. Vol.5 : Proceedings of a meeting held 20-25 March 2005, Turin, Italy
Red Hook, NY: Curran, 2005
ISBN: 978-1-617-82063-2
International Conference on Fracture <11, 2005, Turin>
Fraunhofer IZM ()

Today CAD (computer aided design) simulation methods play a major role in the dimensioning of mechanical structures. It can be observed that a pure CAD approach becomes difficult during the reliability assessment of mechanical-electrical microsystems, because of the complexity of these systems, which originates from the large variety of integrated materials and thus a diversity of the resulting failure mechanisms. Nevertheless a design for reliability is vital for the successful production of MEMS (Micro Electro Mechanical Systems). Therefore strategies dealing with these uncertainties in reliability estimates need to be incorporated in the design process. The approach presented in this paper is based on the application of simulation and advanced deformation measurement methods named microDAC and nanoDAC, which are based on grey scale digital image correlation. It is exemplified on different detail levels of the reliability assessment, with an emphasis on fracture. The first stage consists of a parametric simulation approach, which helps to develop design guidelines for the geometry. For a more absolute quantitative analysis and for material selection in a new design the mechanical properties need to be specified and evaluated with respect to reliability. As the described approach of reliability assessment needs a profound knowledge of the failure behaviour, an analysis is undertaken based on the application of microDAC/nanoDAC techniques. In the prescribed way, it becomes possible to tackle reliability problems in early design phases.