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Micromechanical fabrication of robust low-power metal oxide gas sensors

: Friedberger, A.; Kreisl, P.; Rose, E.; Müller, G.; Kühner, G.; Wöllenstein, J.; Böttner, H.


Sensors and Actuators. B 93 (2003), Nr.1-3, S.345-349
ISSN: 0925-4005
International Meeting on Chemical Sensors (IMCS) <9, 2002, Boston/Mass.>
Zeitschriftenaufsatz, Konferenzbeitrag
Fraunhofer IPM ()
metal oxide; robust gas sensor; Low-Power; micromachined

A fabrication process for miniaturized low-power metal oxide gas sensor arrays is presented. This process, which is based on silicon-on-insulator (SOI) wafers, leads to thermally insulated silicon hot plate structures, which successfully combine low-power consumption with mechanical ruggedness and a high process yield. A second important feature of our process is that it consists of a standard-silicon front-end and a sensor-specific back-end module. This separation into front-end and back-end modules is a prerequisite for an efficient workshare between silicon foundries and SME sensor manufacturers in the industrialization of low-power gas sensor arrays. In the first part of the paper we present an outline of the fabrication flow consisting of the front-end fabrication of micromachined low-power heater platforms and the back-end fabrication of gas-sensitive layers. In the second part we report on the results of extensive mechanical, thermal and gas sensing measurements on such miniaturized devices.