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Integrated nano scale multilayer systems for reactive bonding in microsystems technology

 
: Braeuer, J.; Besser, J.; Wiemer, M.; Gessner, T.

:

Beyne, Eric (General Chair) ; IEEE Components, Packaging, and Manufacturing Technology Society; Institute of Electrical and Electronics Engineers -IEEE-:
4th Electronic System-Integration Technology Conference, ESTC 2012 : Amsterdam, Netherlands, 17 - 20 September 2012
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4645-0
S.400-403
Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>
Englisch
Konferenzbeitrag
Fraunhofer ENAS ()

Abstract
This paper is presenting a metallic wafer bond process at room-temperature by using nano scale and integrated Pd/Al reactive multilayer systems. These systems are used as controllable and internal heat sources. By controlling the reaction properties of the systems strong and high yield wafer bonding of Si-Si, Si-glass as well as Si-ceramic without any significant defects is possible.

: http://publica.fraunhofer.de/dokumente/N-256596.html