Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Investigation of different nano scale energetic material systems for reactive wafer bonding

: Braeuer, J.; Besser, J.; Tomoscheit, E.; Klimm, D.; Anbumani, S.; Wiemer, M.; Gessner, T.


Goorsky, M. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 12. Science, Technology, and Applications : Held during PRiME 2012, October 7 to 12, 2012, Honolulu, Hawaii
Pennington, NJ: ECS, 2012 (ECS transactions 50.2012, Nr.7)
ISBN: 978-1-62332-006-5
ISBN: 978-1-60768-355-1
ISSN: 1938-5862
International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications <12, 2012, Honolulu/Hawaii>
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) <2012, Honolulu/Hawaii>
Fraunhofer ENAS ()

This paper introduces a method that uses a specific form of local heat generation, which is based on nano scale reactive multilayer systems. Such systems consist of several layers of minimum two different materials with nano scale thicknesses. These layers generate heat based on a self-propagating exothermic reaction during their intermixing. The resulting heat can be used as heat source for bonding processes at chip and wafer-level.