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Multi-step approach for thermal optimization of 3D-IC and package

: Heinig, A.; Sohrmann, C.


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE International 3D Systems Integration Conference, 3DIC 2011 : 31.Jan 2012-2.Feb. 2012, Osaka
Piscataway: IEEE, 2012
ISBN: 978-1-4673-2190-7 (online)
IEEE International 3D Systems Integration Conference (3DIC) <2012, Osaka>
Fraunhofer IIS ()

The move from 2D to 3D integration of digital electronic systems (e.g. a multiprocessor with memory) offers a great deal of advantages and is clearly the most promising option for designing future systems. However, the density of the heat dissipation spots is much higher in 3D systems. In the design of such systems, the temperature distribution of the whole system including the package solution must be consider and optimized. In this paper a common optimization approach for early (pathfinding) and later (floorplan) timing and thermal optimization is presented. The developed optimization engine can be used - with different inputs - for both steps (pathfinding and floorplanning). The developed flow is successfully applied to a 3D VLIW-processor.