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2004
Journal Article
Titel
Micro electron beam welding and laser machining - potentials of beam welding methods in the micro-system technology
Abstract
Besides their high rating in macro-range industrial manufacturing processes, beam joining methods are also increasingly gaining in importance in the micro-system technology (MST). While the industry is already using the laser beam for joining, surface modifications or for structuring with different process variations, micro-range electron beam joining is still in the laboratory stage. The advantages of both technologies are especially the low thermal load on the components, the precise energy input, virtually no wear of the tools and the short access times. In the field of MST the possibility of the exact focussing on beam diameters of just a few micrometers is, above all, the most crucial characteristic which makes the micro-dimension application of those methods interesting. Moreover, both methods stand out for their specific technological properties. Electromagnetic coils allow the almost inertia-free movement of the electron beam. This allows extreme high-frequency oscillations which entail different advantages for welding. The electron beam is, in its function as carrier of electric charges which must be reduced from the component, most suitable for metal materials. The joining environment is a vacuum chamber which, to a high degree, protects the components against contamination and possible oxide formation. As it has the character of light, the laser radiation, on the other hand, is able to penetrate transparent materials and to convey its energy locally into lower layers. This effect may be used in order to produce positive substance joints of two components at their contact area. In connection with the assembly of hybrid micro-systems, the process characteristics of electron beam and laser beam joining are considered within the scope of SFB 440 (special research area) (4 partial projects). Main points of research are micro electron beam welding, laser beam soldering, laser beam silicon-glass-bonding and also laser transmission welding of plastics. Moreover, the process-specific basics are to be elaborated.