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Metal injection moulding of tungsten and molybdenum copper alloys for microelectronic packaging

 
: Petzoldt, F.; Knüwer, M.; Wichmann, K.-H.; Cristofaro, N. de

Eisen, W.B. ; Metal Powder Industries Federation -MPIF-, Princeton/N.J.:
Advances in Powder Metallurgy & Particulate Materials 2001. Part 4: Powder injection molding (metals and ceramics) : Proceedings of the 2001 International Conference on Powder Metallurgy & Particulate Materials, May 13-17th, New Orleans
Princeton: MPIF, 2001
ISBN: 1-87895-482-2
S.118-125
International Conference on Powder Metallurgy & Particulate Materials (PM2TEC) <2001, New Orleans/La.>
Englisch
Konferenzbeitrag
Fraunhofer IFAM ()

: http://publica.fraunhofer.de/dokumente/N-25029.html