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Picosecond laser ablation of transparent materials

 
: Russ, S.; Siebert, C.; Eppelt, U.; Hartmann, C.; Faißt, B.; Schulz, W.

:

Klotzbach, U.; Lu, Y.; Washio. K. ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Laser-based Micro- and Nanopackaging and Assembly VII : 6-7 February 2013, San Francisco
Bellingham, WA: SPIE, 2013 (Proceedings of SPIE 8608)
ISBN: 978-0-8194-9377-4
Paper 86080E
Conference "Laser-based Micro- and Nanopackaging and Assembly" <7, 2013, San Francisco/Calif.>
Englisch
Konferenzbeitrag
Fraunhofer ILT ()

Abstract
Processing of thin and ultra-thin glass displays is becoming more important in the fast increasing market of display manufacturing. As conventional technologies such as mechanical scribing followed by manual breaking mostly lead to bad edge quality and thus to a huge amount of reject, other processes like ablation processes with picosecond lasers are getting more and more interesting. However processing with ultrashort pulsed lasers partially leads to unwanted effects which should be understood in a better way by means of intensive basic research. Therefore the ablation mechanism of ultrashort pulses on transparent materials was investigated in this research project. On the one hand the ablation mechanism was analyzed in a simulative way by means of rate equations on the other hand by laboratory experiments.

: http://publica.fraunhofer.de/dokumente/N-246808.html