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2004
Conference Paper
Titel
Cost-effective test, calibration and assembly infrastructure for turnkey integrated pressure sensors
Abstract
Even in the customer specific solution domain MEMS manufacturers are facing an increasing request for low cost turnkey products. Fully calibrated sensors with high performance, light weight and small dimension packages are demanded. Considering the cost of a MEMS device the silicon dice constitutes just about one third or less of the total component cost. As the silicon fabrication process has already been cost optimised by using batch fabrication, lowering the remaining more than two thirds of the component cost in testing, calibration and assembly by fully automation offers the biggest potential to meet the market requirement for cost-effective turnkey solution. This paper presents a cost-effective test, calibration and assembly infrastructure for turnkey integrated pressure sensors that has been implemented in the fabrication line of the Fraunhofer IMS for the production of barometric pressure sensor. The calibration of the sensors is performend on wafer level during the full automated standard electrical circuit test. After dicing the devices are assembled using automated cassette-to-cassette operation. Choosing a CLCC8 housing with the outer dimensions of 5 x 5 x 1.7 mm3 results in one of the world smallest packaged integrated pressure sensor.