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A new aluminium alloy for heavy wire bonding in power

First tests of bonding behaviour and reliability
: Geißler, Ute; Göhre, J.-M.; Thomas, S.; Schneider-Ramelow, M.; Lang, K.-D.

MESAGO PCIM GmbH, Stuttgart:
PCIM Europe 2013. Proceedings. CD-ROM : International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, 14 - 16 May 2013
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3505-1
PCIM Europe <2013, Nuremberg>
Fraunhofer IZM ()

Al heavy wire bonding is the main interconnection technology for the top side of power semiconductors. However, its reliability in power cycling conditions limits the lifetime of power modules. In this paper we report about the development of a new Al-alloy (AlX) for heavy wire bonding. The AlX-alloy is characterized by precipitation hardening effects in the temperature range of 200-300°C. In contrast to the conventionally used pure Al-wires this leads to an increasing strength and breaking load at higher temperatures. So the AlX-alloy enables the use of an Albased bonding wire for high temperature applications. First tests of its behavior in the heavy wire bonding process and the results of first reliability investigations will be presented.