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Exceeding the limitations in E-Manufacturing

: Tolksdorf, D.; Köhnlein, M.

Chlebus, E.; Meyer, R. ; University of Technology Wroclaw, Institute of Production Engineering & Automation; University of Technology Wroclaw, Center for Advanced Manufacturing Technologies:
Rapid Production 2004 : Innovation - Knowledge - Industry. 1st International Conference, Wroclaw, 29.9. - 1. 10.2004
Warschau: Oficyna Wydawnicza Politechniki Warszawskiej, 2004 (Scientific Papers of the Institute of Production Engineering and Automation of the Wroclaw University of Technology 85)
International Conference Rapid Production <1, 2004, Wroclaw>
Fraunhofer IPA ()
E-Manufacturing; Lasersintern; thick film; powder material; CAD; Sintern; Fertigung

This paper presents some aspects to exceed the dimensional limitations in e-manufacturing. Beginning with concept and design of complex models of about 10 mm in length and height with functional surfaces a data processing is conducted to convert the CAD-Data into STL. Subsequently, support generation and data slicing has been performed before the data can be loaded into the machine. The Laser-Sintering process has been executed on EOSINT M 250 Xt with a series of pre-identified optimized process control data. Standard Material, i.e. DirectMetal20 (Ni-Cu-CuP alloy) with a layer thickness of 20 Mikrometer has been used to generate the models. A quality check to determine the dimensional errors between the CAD-models and generated models has been conducted after the Laser-Sintering process is completed. Finally, the accuracy is identified of about 50 Mikrometer in x- and y-direction. The research are about to be continued to increase the accuracy and the surface quality by using conductor materials with thinner layer thickness of about 10 Mikrometer and beyond, such as ceramics and metals with small ratios of binders and additives. Additionally, on the operation side a complete new innovative recoating technique are designed for coating the substrate completely with conductor materials. The results are promising that optimized processing data the production of Direct Microparts with functional properties on the surface are possible in the future.