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A microwave curing system for microelectronics assembly

 
: Adamietz, Raphael; Tilford, Tim; Ferenets, Marju; Pavuluri, Sumanth Kumar; Desmulliez, Marc P.Y.; Bailey, Chris

:

Beyne, Eric (General Chair) ; IEEE Components, Packaging, and Manufacturing Technology Society; Institute of Electrical and Electronics Engineers -IEEE-:
4th Electronic System-Integration Technology Conference, ESTC 2012 : Amsterdam, Netherlands, 17 - 20 September 2012
New York, NY: IEEE, 2012
ISBN: 978-1-4673-4645-0
S.449-453
Electronics System Integration Technology Conference (ESTC) <4, 2012, Amsterdam>
Englisch
Konferenzbeitrag
Fraunhofer IPA ()
Aufbautechnik; Verbindungstechnik; Packaging; curing; Mikroelektronik; Mikrowelle; Härten

Abstract
An approach to curing thermosetting polymers ist the use of Variable Frequency Microwave (VFM) systems, which have been shown to cure encapsulation materials in substantially shorter times than conventional methods. The microwave curing of thermosetting polymer material is a complex process, with interactions between electromagnetic field intensity, temperature, polymer cure kinetics and resulting development of potential thermomechanical stresses. As the real-time in-situ experimental analysis of a number of these parameters is extremely challenging, a numerical model has been developed to assess this process.
The integration of microwave curing into an existing assembly machine imposes the requirement of a compact microwave system, based on a solid state source. Such a system has been designed and installed into our prototype demonstrator.
A series of shear tests have been performed on an electrically conductive adhesive and an encapsulation material. No major deviation between microwave-cured material and material cured in a cnovection oven has been witnessed. Fourier Transform Infra-Red (FTIR) experiments were carried out on uncured, conventionally and microwave cured samples. The spectra of microwave cured and conventionally cured samples were practically identical. A series of LM-2940 dies have been die- and wirebonded to a Mirror Semiconductor open cavity package. Tests have demonstrated that the encapsulation and subsequent microwave curing can be performed without without evident detrimental effects.

: http://publica.fraunhofer.de/dokumente/N-241789.html