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Wafer level vacuum packaging of scanning micro-mirrors using glass-frit and anodic bonding methods

: Langa, Sergiu; Drabe, Christian; Kunath, Christian; Dreyhaupt, André; Schenk, Harald


Ramesham, Rajeshuni (Ed.) ; Society of Photo-Optical Instrumentation Engineers -SPIE-, Bellingham/Wash.:
Reliability, packaging, testing, and characterization of MOEMS/MEMS and nanodevices XII : 4 - 5 February 2013, San Francisco, California, United States
Bellingham, WA: SPIE, 2013 (Proceedings of SPIE 8614)
ISBN: 978-0-8194-9383-5
Paper 86140F
Conference "Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS and Nanodevices" <12, 2013, San Francisco/Calif.>
Fraunhofer IPMS ()
green photonics; wafer level vacuum packaging; micro-mirrors; wafer bonding; energy efficiency

In this paper the authors report about the six inch wafer level vacuum packaging of electro-statically driven two dimensional micro-mirrors. The packaging was done by means of two types of wafer bonding methods: anodic and glass frit. The resulting chips after dicing are 4 mm wide, 6 mm long and 1.6 mm high and the residual pressure inside the package after dicing was estimated to be between 2 and 20 mbar. This allowed us to reduce the driving voltage of the micro-mirrors by more than 40% compared to the driving voltage without vacuum packaging. The vacuum stability after 5 months was verified by measurement using the so called "membrane method". Persistence of the vacuum was proven. No getter materials were used for packaging.