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In-situ investigation of the influence of the crystallographic grain orientation on the anodic dissolution of copper under near-ECM conditions

In-Situ-Untersuchung des Einflusses der kristallographischen Kristallorientierung auf die anodische Kupferauflösung unter ECM-nahen Bedingungen
: Schneider, M.; Schroth, S.; Richter, S.; Schubert, N.; Michaelis, A.

Deconinck, J. ; Vrije Universiteit Brussel, Faculty of Engineering:
6th International Symposium on Electrochemical Machining Technology, INSECT 2010 : Vrije Universiteit Brussel, 4.-5. November 2010
Brussel: Brussel University Press, 2010
ISBN: 978-90-5487-818-6
International Symposium on Electrochemical Machining Technology (INSECT) <6, 2010, Brüssel>
Fraunhofer IKTS ()

Electrochemical Machining is usually characterized by severe anodic dissolution of the material. To observe this process simultaneously and in-situ, we designed an electrochemical cell which scales the ECM parameters down to laboratory conditions. We carried out galvanostatic pulse experiments with varying amplitudes on copper in sodium nitrate. The surface was microscopically observed and the change in roughness was semi-quantified using an optical laser. Based on EBSD measurements of the surface before the electrochemical experiments a correlation between surface topography development and crystallographic orientation is possible. The current efficiency of copper removal was estimated by uv/visspectrometry of Cu 2+-ions in waste electrolyte compared with the coulometric estimated charge. It can be summarized that the dissolution of copper at 25A/cm 2 takes place already in the transpassive stage. In this stage the influence of the crystallographic orientation on the dissolution seems to be negligible. Moreover, the material removing leads to a polishing effect of the surface. The observed pits are probably associated with the dissolution of very small copper oxide precipitates in the used E-Cu57 material. It could be evidenced that the current efficiency is lower than 100%.