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Challenges and methods for the design of 3D-integrated smart systems

 
: Knöchel, Uwe

Gessner, Thomas (Ed.) ; Fraunhofer-Institute for Electronic Nano Systems -ENAS-, Chemnitz; Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration -IZM-, Berlin; MESAGO Messe Frankfurt GmbH, Stuttgart:
Smart Systems Integration 2013. CD-ROM : Amsterdam, The Netherlands, 13 - 14 March 2013, 7th International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components
Berlin: VDE-Verlag, 2013
ISBN: 978-3-8007-3490-0
8 S.
International Conference & Exhibition on Integration Issues of Miniaturized Systems - MEMS, NEMS, ICs and Electronic Components <7, 2013, Amsterdam>
Englisch
Konferenzbeitrag
Fraunhofer IIS, Institutsteil Entwurfsautomatisierung (EAS) ()

Abstract
More than Moore technologies like 3D-integration opens new paths to highly integrated smart systems. While manufacturing technologies are still in development, it is also needed to develop related design methods. The design of an interposer with wide I/O memory interface is demonstrated. It considers manufacturability and costs. Without interposers, the codesign of die stack and package is required. A preliminary 3D floor planning flow with electrical and thermal optimization is shown.

: http://publica.fraunhofer.de/dokumente/N-238361.html