Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Progress with multi-step metallization processes featuring copper as conducting layer at Fraunhofer ISE

: Bartsch, J.; Mondon, A.; Kamp, M.; Kraft, A.; Wendling, M.; Mehling, M.; Wehkamp, N.; Jawaid, M.; Lorenz, A.; Clement, F.; Schetter, C.; Glatthaar, M.; Glunz, S.

Volltext urn:nbn:de:0011-n-2364769 (349 KByte PDF)
MD5 Fingerprint: 6c9c5c1e2ee8a42592057c8c06eada09
Erstellt am: 27.4.2013

Nowak, S. ; European Commission:
27th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2012. DVD-ROM : Proceedings of the international conference held in Frankfurt, Germany, 24 - 28 September 2012
München: WIP-Renewable Energies, 2012
ISBN: 3-936338-28-0
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <27, 2012, Frankfurt>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer ISE ()
Solarzellen - Entwicklung und Charakterisierung; Silicium-Photovoltaik; Kontaktierung und Strukturierung; Industrielle und neuartige Solarzellenstrukturen

The present work gives an overview of the activities in multi-step front side metallization for crystalline silicon solar cells featuring copper as conducting layer at Fraunhofer ISE. Different approaches are being followed, the two most important being the deposition of nickel and copper onto printed and fired silver seed layers, or directly onto silicon. The first mentioned technique has been found to exhibit an important potential to reduce the silver consumption per cell. Below 40 mg of printing paste per wafer could be deposited by screen printing, as little as 8 mg by aerosol jet printing and metal inkjet printing. Progress with the challenge of adhesion after plating is presented, although further improvement is still needed. The highest peel force that could be achieved was >1.5 N/mm busbar width. For the second concept, detailed investigations of the contact interface have been done, to tackle the challenge of adhesion. An adaptation of the surface geometry is found to raise adhesion, but only 0.6 N/mmBB have been achieved, which is still insufficient. A silicidation process seems to be necessary to obtain sufficient adhesion.