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Advanced characterization of glass frit bonded micro-chevron-test samples based on scanning acoustic microscopy

: Naumann, F.; Brand, S.; Bernasch, M.; Tismer, S.; Czurratis, P.; Wünsch, D.; Petzold, M.

Preprint urn:nbn:de:0011-n-2364392 (87 KByte PDF)
MD5 Fingerprint: 003c7781d9076a39a26d856a268c1103
The original publication is available at
Erstellt am: 23.5.2014

Microsystem Technologies 19 (2013), Nr.5, S.689-695
ISSN: 0946-7076
Zeitschriftenaufsatz, Elektronische Publikation
Fraunhofer IWM ()
glass frit bonding; micro-chevron-test; MCT; scanning acoustic microscopy; SAM

Glass frit bonding is a widely used encapsulation technology for micro-electro mechanical systems. In order to guarantee functionality and reliability of a bonding seal, qualified test methods are required for evaluating the quality and strength of the bonding interfaces which are considered key parameters. In the presented work adapting the micro-chevron-test for glass frit bonded samples and arising challenges are discussed. Motivated by the industrial application of glass frit bonding generally used for frame structures an application related guideline for the application of micro-chevron-testing is presented. In addition, high resolution acoustic inspection is used as a key technology for estimating the effective bond strength in combination with further experimental testing and is likewise used for sample pre-selection and defect localization. The presented content provides a sequential overview beginning with sample preparation of glass frit bonded micro chevron samples to mechanical testing and the result analysis as well as a statistical interpretation of a bonded silicon test wafer.