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A study of factors influencing micro-chevron-testing of glass frit bonded interfaces

: Naumann, F.; Bernasch, M.; Brand, S.; Wünsch, D.; Vogel, K.; Czurratis, P.; Petzold, M.


Goorsky, M. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 12. Science, Technology, and Applications : Held during PRiME 2012, October 7 to 12, 2012, Honolulu, Hawaii
Pennington, NJ: ECS, 2012 (ECS transactions 50.2012, Nr.7)
ISBN: 978-1-62332-006-5
ISBN: 978-1-60768-355-1
ISSN: 1938-5862
International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications <12, 2012, Honolulu/Hawaii>
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) <2012, Honolulu/Hawaii>
Konferenzbeitrag, Zeitschriftenaufsatz
Fraunhofer IWM ()
Fraunhofer ENAS ()
micro-chevron-testing; glass fritbonded MEMS components

The presented investigations revealed different factors affecting Micro Chevron testing of glass frit-bonded factors. From the results, conclusions and guidelines can be derived how to optimize the test in terms of sample geometry, by sample preselecting using non-destructive testing prior to bonding, by adapted testing conditions, and by advanced data evaluation. Thus, the study contributes to increase the tests reliability and significance, and to establish the test as a more standardized routine for industrial control of glass fritbonded MEMS components.