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Low temperature interconnection techniques for high efficiency heterojunction solar cells

: Rebenklau, L.; Gierth, P.; Partsch, U.; Mehlich, H.; Hausmann, J.; Grimm, M.; Stein, W.; Bell, H.; Clement, C.; Vogg, F.


Nowak, S. ; European Commission:
27th European Photovoltaic Solar Energy Conference and Exhibition, EU PVSEC 2012. DVD-ROM : Proceedings of the international conference held in Frankfurt, Germany, 24 - 28 September 2012
München: WIP-Renewable Energies, 2012
ISBN: 3-936338-28-0
European Photovoltaic Solar Energy Conference and Exhibition (EU PVSEC) <27, 2012, Frankfurt>
Fraunhofer IKTS ()
heterojunction; polymer film; interconnection; cell metallization

The heterojunction cell concept enables high efficiencies and simultaneously low-cost production. Roth & Rau AG provide tools and processes for mass production of heterojunction technology (HJT) based solar cells. New low temperature interconnection techniques are needed for this cell concept. This work focuses on the evaluation of the characteristics of polymer pastes based on silver and copper particles. Therefore different curing atmospheres of an inert inline drying system (Rehm Thermal Systems) were used. The electrical resistance, adhesion, and solderability of the screen printed pastes were evaluated. As we will show in the present work, the currently available copper pastes can be an equivalent alternative to common used silver pastes.