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Thermal laser separation - damage-free and Kerfless cutting of wafers and solar cells

: Koitzsch, Matthias; Lewke, Dirk; Kaule, Felix; Oswald, Marcus; Schoenfelder, Stephan; Turek, Marko; Büchel, Andreas; Zühlke, Hans-Ulrich

Volltext urn:nbn:de:0011-n-2281062 (501 KByte PDF)
MD5 Fingerprint: 9b58f7b5cf5c98c427d25da51d464dca
Erstellt am: 20.2.2013

Institut National de L'Energie Solaire -INES-:
6th International Workshop on Crystalline Silicon for Solar Cells, CSSC 2012 : October 8-11, 2012, Aix-les-Bains, France
Aix-les-Bains, 2012
4 S.
International Workshop on Crystalline Silicon Solar Cells (CSSC) <6, 2012, Aix-les-Bains>
Konferenzbeitrag, Elektronische Publikation
Fraunhofer IISB ()
Fraunhofer IWM ()
Kerfless cutting; crystalline silicon; solar cell; wafer dicing

Thermal Laser Separation (TLS) is a damage free and kerfless dicing technology for brittle materials like silicon (Si) wafers and solar cells. By using a defined stress field, due to laser-based heating and subsequent water cooling, one single crack is guided through, e.g., a silicon substrate. This paper describes important aspects and benefits of TLS thus deriving major potential photovoltaic (PV) applications for TLS. Latest experimental results, finite element (FE) simulations, as well as theoretical considerations are taken into account. As a result, TLS is as a novel technology for cutting crystalline solar cells and wafers.