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Advanced Vacuum Wafer Drying for Thermal Laser Separation Dicing Assessment. Results from European collaborative SEAL project

: Le Barillec, Olivier; Davenet, Magali; Bellet, B.; Koitzsch, Matthias; Lewke, Dirk; Schellenberger, Martin; Zühlke, Hans-Ulrich


Mertens, P. ; Interuniversity Micro-Electronics Center -IMEC-, Louvain:
Ultra clean processing of semiconductor surfaces XI : Selected, peer reviewed papers from the 11th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS), September 17 - 19, 2012, Gent, Belgium
Durnten-Zurich: TTP, 2013 (Solid state phenomena 195)
ISBN: 978-3-03-785527-0
International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) <11, 2012, Gent>
Fraunhofer IISB ()
dicing process; drying; decontamination; manufacturing

Based on recent progress on laser-based wafer dicing equipment and process, the partners adixen, Fraunhofer IISB and JENOPTIK investigated the use of a vacuum based decontamination process to dry and to decontaminate the substrate surface of the diced wafers from water residuals, which are a side-effect of the TLS (thermal laser separation) approach. The decontamination process was achieved by using an adixen vacuum drying module prototype further to the JENOPTIK TLS dicing process. Within the frame of the European collaborative project SEAL, supported by the European Commission, experimental assessment was conducted by Fraunhofer IISB (research institution) together with JENOPTIK and Adixen.