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Film thickness standards on the nanometer scale

: Hasche, K.; Ulm, G.; Herrmann, K.; Krumrey, M.; Ade, G.; Stümpel, J.; Busch, I.; Thomsen-Schmidt, P.; Schädlich, S.; Schindler, A.; Frank, W.; Procop, M.; Beck, U.

American Society for Precision Engineering -ASPE-:
American Society of Precision Engineering. 17th Annual meeting 2002. Proceedings : October 20 - 25, 2002, Hyatt Regency St. Louis at Union Station, St. Louis, Missouri
Raleigh, NC: ASPE, 2002
ISBN: 1-88770-629-1
American Society for Precision Engineering (Annual Meeting) <17, 2002, St. Louis/Mo.>
Fraunhofer IWS ()

Reference standards for film thickness and calibration techniques for two different kinds of measuring instruments being widely applied in semiconductor technology and other fields where film thickness in the nanometer range plays a significant role are developed, evaluated and tested. One is for typical X-ray methods, like X-ray reflectometry (XRR) under grazing incidence, X-ray fluorescence analysis (XRF) and electron probe microanalysis (EPMA). Calibration of thickness and evaluation of further parameters qualifying the artifacts as reference standard s base primarily on XRR. The second type is created for ellipsometry and has a small topographic structure which allows determination of the film thickness by scanning force microscopy (SFM) in combination with additional evaluations by transmission electron microscopy (TEM). A short overview on manufacturing and some results of characterization for both types of reference standards are presented here.