Hier finden Sie wissenschaftliche Publikationen aus den Fraunhofer-Instituten.

Thin layer measurements need reference standards

: Hasche, K.; Herrmann, K.; Krumrey, M.; Ulm, G.; Ade, G.; Thomsen-Schmidt, P.; Schädlich, S.; Frank, W.; Procop, M.; Beck, U.

Hasche, K. ; Physikalisch-Technische Bundesanstalt -PTB-, Braunschweig:
5th Seminar on Quantitative Microscopy and 1st Seminar on Nanoscale Calibration Standards and Methods, NanoScale 2001. Proceedings : Dimensional measurements in the micro- and nanometre range. November 15th and 16th, 2001, Bergisch Gladbach, Germany
Bremerhaven: Wirtschaftsverlag NW, Verlag für neue Wissenschaft, 2001 (PTB-Bericht F-44)
ISBN: 3-89701-840-3
Seminar on Quantitative Microscopy <5, 2001, Bergisch Gladbach>
Seminar on Nanoscale Calibration Standards and Methods (NanoScale) <1, 2001, Bergisch Gladbach>
Fraunhofer IWS ()

It is intended to create two types of artifacts to contribute to traceable measurement results in respect of thickness of thin layers in the thickness range below 100 nm. After their calibration these artifacts shall serve as reference standards for layer thickness measurements. The objective of this paper is to communicate some results on the manufacture and different measurements for the characterisation of these artifacts. The technology of manufacturing reference standards for X-ray diffractometry bases on smoothing of the surface of a substrate to a remaining roughness smaller than 0.3 nm and physical vapour deposition (PVD) techniques being well approved in the field of manufacturing X-ray mirrors and on other tasks of sophisticated surface technology. The calibration of the film thickness and evaluation of further parameters characterising the artifact as reference standard base primarily on X-ray diffractometry. The results found by independent evaluations on different methods show satisfying consistency. In the case of layer thickness of only a few nanometres the existence of interdiffusion between the layer material and the substrate cannot be excluded. This is analysed by TEM.