Abstract
Plasma texturing is a promising alternative to wet chemical texturing of solar cells. Processes using increased ion energies have previously been shown to be advantageous on single wafer tools. In this work, the microwave plasma of an inline tool is enhanced by a radiofrequency field, which leads to a DC self bias and thus increased ion energies. A high-throughput process suitable for monocrystalline cells has been developed and characterized by weighted reflection and excess carrier lifetime on float zone material. Additionally, experiments on shiny etched wafers with <111> and <100> orientation have been shown to be a promising approach to finding parameters for etching independent of crystal orientation.