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Laser transmission bonding of silicon with titanium and copper layer for wafer-level packaging

 
: Wissinger, A.; Schmitz, M.; Olowinsky, A.; Gillner, A.; Poprawe, R.

:

Goorsky, M. ; Electrochemical Society -ECS-:
Semiconductor Wafer Bonding 12. Science, Technology, and Applications : Held during PRiME 2012, October 7 to 12, 2012, Honolulu, Hawaii
Pennington, NJ: ECS, 2012 (ECS transactions 50.2012, Nr.7)
ISBN: 978-1-62332-006-5
ISBN: 978-1-60768-355-1
ISSN: 1938-5862
S.189-198
International Symposium on Semiconductor Wafer Bonding - Science, Technology and Applications <12, 2012, Honolulu/Hawaii>
Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) <2012, Honolulu/Hawaii>
Englisch
Konferenzbeitrag
Fraunhofer ILT ()

: http://publica.fraunhofer.de/dokumente/N-220940.html