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Correction to "Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias" (vol 12, pg 225, 2012)
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2012
Journal Article
Titel
Correction to "Copper anisotropy effects in three-dimensional integrated circuits using through-silicon vias" (vol 12, pg 225, 2012)
Author(s)
Karmarkar, A.P.
Xu, X.P.
Yeap, K.B.
Zschech, E.
Zeitschrift
IEEE transactions on device and materials reliability
DOI
10.1109/TDMR.2012.2209531
Language
English
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