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Advanced thin glass based photonic PCB integration

: Schröder, Henning; Brusberg, L.; Arndt-Staufenbiel, Norbert; Richlowski, Karim; Ranzinger, Christian; Lang, Klaus-Dieter


Institute of Electrical and Electronics Engineers -IEEE-:
IEEE 62nd Electronic Components and Technology Conference, ECTC 2012 : May 29 2012-June 1 2012, San Diego, CA
New York, NY: IEEE, 2012
ISBN: 978-1-4673-1966-9 (Print)
ISBN: 978-1-4673-1964-5 (Online)
Electronic Components and Technology Conference (ECTC) <62, 2012, San Diego/Calif.>
Fraunhofer IZM ()

The central aim of the overall is the realization of electro-optical circuit boards (EOCB) by using thin glass as known from display technology. Such technologies give the possibility to develop products with improved performance, higher reliability, lower costs and higher energy efficiency. A crucial building block is the integration of optical signal transmission within the EOCB. A presentation of size-enlarged EOCB with holohedrally integrated glass foils is subject of the paper. These EOCB are capable to provide future bandwidth standards through integrated optical waveguides for high speed intra system optical data transmission as well as sensor technology. Therefore structuring technologies have been developed that are compatible to the industrially introduced PCB manufacturing. Already established processes as well as new approaches were analyzed for their eligibility and have been applied for the EOCB process.