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Strength and reliability properties of glass frit bondet micro packages

: Glien, K.; Graf, J.; Müller-Fiedler, R.; Höfer, H.; Ebert, M.; Bagdahn, J.

Courtois, B. ; Tima-Cmp Laboratory; IEEE Circuits and Systems Society:
Design, Test, Integration and Packaging of MEMS / MOEMS. DTIP 2004. Proceedings : Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Montreux, Switzerland, 12 - 14 May 2004
Grenoble: TIMA Laboratory, 2004
ISBN: 2-8481-3026-1
Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP) <2004, Montreux>
Fraunhofer IWM ()
MEMS; glass frit; Mikrosystem

The hermetic package is one crucial element to ensure high reliability and lifetime of micro mechanical sensors in automotive applications. In a proactive approach fundamental reliability limiting effects are investigated. The bond quality of aged samples is characterised by Weibull analysis of tensile tested samples. By FE analysis the three dimensional stress distribution in the bond frame during tensile testing is evaluatet using the maximum principal stresses determined by experimentally obtained fracture forces. The Micro-Chevron-Test is applied for the first time to samples containing an intermediate glass frit layer. A meande ring crack path is observed and the fracture toughness is determined.